The industry’s success depends on:

* The adoption of “performance-based contracting” for after-sales product support

* The amalgamation of product development and planning systems.

Chipmakers are known to be “critically dependent” on the industry’s network to create value centric offerings. Adjacent industry segments, emerging geographies and innovative business models will form industry trends for the next generation. “Smart, connected products” are at or nearing a tipping point for semiconductor innovation. In order to provide lower cost chips with more features, semiconductor innovations will need to conquer technological and commercial obstacles.

Challenges

In order to fit in more in each silicon wafer chip, semiconductor companies are working towards making smaller transistors. Currently, these companies are designing 14nm chips and aim to make 5nm chips by 2017. Chip manufacturers will need to adopt newer technologies like extreme ultraviolet (EUV) lithography (which are not yet commercially viable and are still evolving) for circuit design on silicon wafers. Use of highly developed materials to manufacture chips and increasing the energy efficient devices to cope with increased processing power seems to be a looming challenge because device users are unable to simultaneously operate several processes beyond a point to maximize power consumption. Additionally, though the technology is in its development stages, manufacturers are looking at the possibility of replacing silicon with ‘Graphene’. Companies will also have to begin looking at economic advantages due to the trend ‘dark silicon,’ which compels a part of the chip to power down (dark) to help preserve battery power.

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