Magazine : Sarosh Patel
Current
Program Manager, Flextronics,...
Education
M.B.A. General Management
Sarosh Patel ’s experience
Program Manager
at
FLEXTRONICS
, Milpitas, CA
Currently Working
Customer facing program manager for Sun Microsystems. Manage the
engineering design/build of the world’s largest Infiniband data
switch being developed by a multisite team in the US and
offshore. Program has been recognized by Sun/Solectron to be a
significant technical achievement, and has exceeded the schedule
and performance expectations initially set. Product was
successfully launched in July 2007 at the International
Supercomputing Show in Dresden, and received the Sun Chairman’s
award for 2007.
engineering design/build of the world’s largest Infiniband data
switch being developed by a multisite team in the US and
offshore. Program has been recognized by Sun/Solectron to be a
significant technical achievement, and has exceeded the schedule
and performance expectations initially set. Product was
successfully launched in July 2007 at the International
Supercomputing Show in Dresden, and received the Sun Chairman’s
award for 2007.
Engineering Manager at KLA-TENCOR , Milpitas, CA
January 2007
Responsible for engineering group in Milpitas and Singapore,
chartered with development of electromechanical packaging for
Common Platform Bright Field and Dark Field Wafer Inspection
equipment. Responsible for offshore development of
electromechanical packaging for systems in India and
Singapore. Accomplishments • Thermal and mechanical
packaging of several rack mount servers into a low cost package
to used in a clean room environment across all
platforms. • Offshore development and program management of
electromechanical systems – from concept through pre-production
prototype.
chartered with development of electromechanical packaging for
Common Platform Bright Field and Dark Field Wafer Inspection
equipment. Responsible for offshore development of
electromechanical packaging for systems in India and
Singapore. Accomplishments • Thermal and mechanical
packaging of several rack mount servers into a low cost package
to used in a clean room environment across all
platforms. • Offshore development and program management of
electromechanical systems – from concept through pre-production
prototype.
Technology and Business Consultant at TALLWOOD , Palo Alto, CA
February 2004
Advised Tallwood on new/developing technologies in semiconductor
packaging: Conducted due diligence on companies involved in
thermal interface materials (CNT, metal) first level
semiconductor packaging and thermoelectric cooling.
packaging: Conducted due diligence on companies involved in
thermal interface materials (CNT, metal) first level
semiconductor packaging and thermoelectric cooling.
Manager, Advance Development at TERADYNE , San Jose, CA
October 2003
Responsible for advance development group, chartered with
development of products that open up new markets and extend the
life cycle of existing products. Determined and implemented best
of breed future features. Selected and developed key enabling
technologies internally or outsourced through
partnering. Accomplishments • Improved the company’s
competitive advantage by developing new products. Designs
resulted in five patents that are held jointly by the company and
me. • Ensured product direction-focus through the development
of product roadmap for enabling technologies. • Reduced
thermal interface resistance of chip packaging by over 50%
utilizing nanotechnology, stretching the design envelope for
air-cooled designs. • Identified and evaluated use of CNT
(Carbon Nanotubes) for incorporation into future thermal
products. • Improved the marketability of products under
development by establishing a Competitive Analysis
Process. • Improved profit margin by being part of a business
development team that developed technology solutions for network
server products. • Designed a low-cost mass-producible
plastic microaligner for aligning multiple optical
fibers. Manager, Mechanical Engineering (7 yrs) Led System
Packaging on flagship mixed-signal tester platform. Subsystems
included E/M packaging, manipulator and sequencer design
(robotics), tester to prober/handler interfaces, power supply and
distribution, PCCM and project management. Managed multi-site
department of 19 professionals, including project managers,
mechanical, electrical hardware-software engineers, and an
operating budget of $6 M. Also utilized adjunct staff at
universities and specialty contractors. Accomplishments:
• Received a patent for a Cooling System on 2/16/99 -
implemented on the current mixed signal tester- Tiger. •
Reduced cost of cooling system by 30% by inventing and
implementing novel heat spreader technology. • Reduced
electromechanical design cycle time by 25% through a concurrent
engineering process; cycle time by 30% using a “paperless
process” to fabricate parts directly from Solid Works CAD
models; and prototype costs by minimizing the iterations in the
design process using CAE/CFD tools. • Led the design and
release to manufacturing of the thermal and electromechanical
portion of a new Memory and VLSI tester in eighteen months - a
first for Teradyne. • Reduced product costs by 25% by
specifying and outsourcing components to domestic and
international OEMs and fabricators. • Successfully performed
business development activities with domestic (Intel, Micron,
Sun, TI) and international (Samsung, Hyundai, Gold Star)
semiconductor capital equipment buyers. • Implemented ISO 9001
using TQM methodology and a Harvard RPD (Revolutionizing Product
Development) process. • Corporate Liaison for recruiting at
Stanford. • Senior member of merger/acquisition team that
facilitated the assimilation of acquired company.
development of products that open up new markets and extend the
life cycle of existing products. Determined and implemented best
of breed future features. Selected and developed key enabling
technologies internally or outsourced through
partnering. Accomplishments • Improved the company’s
competitive advantage by developing new products. Designs
resulted in five patents that are held jointly by the company and
me. • Ensured product direction-focus through the development
of product roadmap for enabling technologies. • Reduced
thermal interface resistance of chip packaging by over 50%
utilizing nanotechnology, stretching the design envelope for
air-cooled designs. • Identified and evaluated use of CNT
(Carbon Nanotubes) for incorporation into future thermal
products. • Improved the marketability of products under
development by establishing a Competitive Analysis
Process. • Improved profit margin by being part of a business
development team that developed technology solutions for network
server products. • Designed a low-cost mass-producible
plastic microaligner for aligning multiple optical
fibers. Manager, Mechanical Engineering (7 yrs) Led System
Packaging on flagship mixed-signal tester platform. Subsystems
included E/M packaging, manipulator and sequencer design
(robotics), tester to prober/handler interfaces, power supply and
distribution, PCCM and project management. Managed multi-site
department of 19 professionals, including project managers,
mechanical, electrical hardware-software engineers, and an
operating budget of $6 M. Also utilized adjunct staff at
universities and specialty contractors. Accomplishments:
• Received a patent for a Cooling System on 2/16/99 -
implemented on the current mixed signal tester- Tiger. •
Reduced cost of cooling system by 30% by inventing and
implementing novel heat spreader technology. • Reduced
electromechanical design cycle time by 25% through a concurrent
engineering process; cycle time by 30% using a “paperless
process” to fabricate parts directly from Solid Works CAD
models; and prototype costs by minimizing the iterations in the
design process using CAE/CFD tools. • Led the design and
release to manufacturing of the thermal and electromechanical
portion of a new Memory and VLSI tester in eighteen months - a
first for Teradyne. • Reduced product costs by 25% by
specifying and outsourcing components to domestic and
international OEMs and fabricators. • Successfully performed
business development activities with domestic (Intel, Micron,
Sun, TI) and international (Samsung, Hyundai, Gold Star)
semiconductor capital equipment buyers. • Implemented ISO 9001
using TQM methodology and a Harvard RPD (Revolutionizing Product
Development) process. • Corporate Liaison for recruiting at
Stanford. • Senior member of merger/acquisition team that
facilitated the assimilation of acquired company.
Manager, Electromechanical Systems at FUJITSU , Sunnyvale, CA
March 1994
Responsible for the Cooling, Power and Agency Certification
groups. Developed the cooling and power architecture for
computers and managed the agency certification requirements.
Department of ten people consisting of project managers,
mechanical and electrical engineers, three test labs and an
operating budget of $4M. Successfully managed major development
programs through domestic and overseas vendors. Negotiated
specifications, development contracts, costs, schedules and new
product introductions. Accomplishments: • Reduced
time-to-market for mainframe computers by 50%, by conceiving and
implementing the use of "Technology Building Blocks" and
"Commodity Components" for fast cycle time. • Established
strategic vendor partnership with ABB Ceag (Power Supplies) in
Germany. Manager, System Cooling (1 yr) Responsible for
product development and sustaining engineering. Led the thermal
design and contracting effort for computer products. Reorganized
the group, eliminating redundancy and filling functional
gaps. Accomplishments: • Developed solutions to cool high
heat flux applications. Technology resulted in two patent
applications. • Reduced design cycle time by 40 % by
implementing CFD (Computational Fluid Dynamics)
tools. • Reduced inventory and development costs by 30% by
initiating commonality requirements. • Established technical
and business relationships with Fujitsu. • Established
strategic vendor partnership with Liebert for the Cooling
Distribution Unit.
groups. Developed the cooling and power architecture for
computers and managed the agency certification requirements.
Department of ten people consisting of project managers,
mechanical and electrical engineers, three test labs and an
operating budget of $4M. Successfully managed major development
programs through domestic and overseas vendors. Negotiated
specifications, development contracts, costs, schedules and new
product introductions. Accomplishments: • Reduced
time-to-market for mainframe computers by 50%, by conceiving and
implementing the use of "Technology Building Blocks" and
"Commodity Components" for fast cycle time. • Established
strategic vendor partnership with ABB Ceag (Power Supplies) in
Germany. Manager, System Cooling (1 yr) Responsible for
product development and sustaining engineering. Led the thermal
design and contracting effort for computer products. Reorganized
the group, eliminating redundancy and filling functional
gaps. Accomplishments: • Developed solutions to cool high
heat flux applications. Technology resulted in two patent
applications. • Reduced design cycle time by 40 % by
implementing CFD (Computational Fluid Dynamics)
tools. • Reduced inventory and development costs by 30% by
initiating commonality requirements. • Established technical
and business relationships with Fujitsu. • Established
strategic vendor partnership with Liebert for the Cooling
Distribution Unit.
Sarosh Patel ’s education
M.B.A. [General Management],
SUNY Buffalo [January,2009]
, Buffalo, US
MS [Mechanical Engineering],
Stanford University [January,2009] , Palo Alto, US
B.Tech/B.E. [Mechanical Engineering],
M.S. University, India. (1st. Class with Distinction) [January,2009] , Baroda, INDIA
Sarosh Patel ’s additional information
Interests:
-US based management of offshore technology development and manufacturing.
- US based representative of Indian company wanting to develop and build a technology base in the US.
Hey there! Sarosh Patel is using SiliconIndia.
Benefits of SiliconIndia
- Find prospects, new employees or jobs
- Get mentored by industry experts
- Get daily news updates
- Get found in search engines (Google, yahoo)
- Find coworkers and batchmates
