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Ceva, ArrayComm to develop LTE wireless infrastructure solution
By siliconindia
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Monday, 15 February 2010, 18:42 IST
San Jose: Physical layer solutions provider for wireless infrastructure ArrayComm and Ceva, a licensor of silicon intellectual property (SIP) DSP Cores announced an agreement to work toward the implementation of ArrayComm's full Long Term Evolution (LTE) eNodeB PHY on the Ceva-XC DSP core.
This will provide system-on-chip product developers with a pre-optimized PHY software/processor package to incorporate in their overall system design. This collaboration is supported by the Ceva-XCnet Partnership Program, of which ArrayComm is an original member.
Ceva says that the XC processor is designed and optimized for high-performance, low power communications processing, with a single core capable of handling complete 4G transceiver paths fully in software. "Our collaboration with ArrayComm to deliver a full featured eNodeB PHY solution on our Ceva-XC DSP enables our mutual customers to enter the LTE infrastructure market with lower associated risk and cost," said Eran Briman, Vice President of Marketing at Ceva.
ArrayComm's LTE eNodeB PHY is a scalable baseband physical layer solution incorporating ArrayComm's A-MAS multi-antenna signal processing software. According to ArrayComm, delivering these two powerful components as a pre-optimized package allows SoC developers to simultaneously reduce program costs and time to market. "LTE requires high capacity with minimal cost, and SoC technology is the critical component for scalable LTE infrastructure platforms," said Bruce Duysen, President of ArrayComm.
