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AMD unveils processors for BGA embedded platform
By siliconindia
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Monday, 10 August 2009, 21:20 IST
Bangalore: Chipmaker AMD has launched two new dual-core 18W TDP processors for the ASB1 BGA embedded client platform. The AMD Turion Neo X2 processor Model L625 and the AMD Athlon Neo X2 processor Model L325 can deliver PC-caliber performance in a very low power envelope and with an embedded-friendly ball grid array (BGA) package.
This embedded client solution is for traditional embedded applications such as single board computing and thin client systems, as well as markets for self-service kiosks, point of sale machines and digital signage. The BGA package helps alleviate potential reliability issues for systems that are deployed in rugged environments and has a low z-height that is designed to enable thin and compact enclosures.
"Systems such as digital signage, point of sale, and thin clients require PC-class performance and a rich graphics experience. Our ASB1 BGA platform is a ready-to-go, one-stop solution for these markets and at the same time offers the flexibility of multiple CPU and chipset choices," said Buddy Broeker, Director, Embedded Computing Solutions Division, AMD.
Systems based on the new dual-core processors are expected at launch from embedded system providers like Ibase and IEI, among others. "With the AMD Athlon Neo X2 processor, AMD is offering us a new CPU option that improves on the punch of the single core predecessor with a mere three watts increase in processor power consumption," said Dwight Looi, Product Manager, Ibase Technology.
