Rayspan secures $12.5 Million in series B financing

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Rayspan secures $12.5 Million in series B financing
Bangalore: Rayspan Corporation, a San Diego-based developer of metamaterial air interface solutions for wireless communications, has raised $12.5 Million in a series B financing. This was led by new investor Khosla Ventures and was joined by existing investor Sequoia Capital as well as the individual private investors.

This financing will be used by the company to accelerate and expand the development and commercialization of its metamaterial wireless technology. Founded in 2006, Rayspan provides solutions that support a range of fixed and mobile wireless WAN and LAN applications including all 2/3/4G cellular handsets, WiFi, Bluetooth and GPS. Currently, there are about 45 employees in the company.

Franz Birkner, CEO of Rayspan said, "This funding is a clear vote of confidence in Rayspan's exciting opportunity to broadly deploy its metamaterial air interface solutions in the WLAN and 2/3/4G cellular handset markets."

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