NXP & SRV Telecom tie-up for Digital Cordless Telephone

By siliconindia   |   Tuesday, 19 December 2006, 18:30 IST
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Bangalore: NXP Semiconductors, formerly Philips Semiconductors, and SRV Telecom Pvt. Ltd.announced a collaboration to design, develop and manufacture Digitally Enhanced Cordless Telephones (DECT) in India. These phones will target home as well as enterprise markets. NXP will provide its proven three-chip DECT chipsets, including an RF amplifier (RF-PA), a transceiver (TX-RX) and a baseband IC designed on an ARM7 core. SRV Telecom will design, manufacture and market the phones in India. Commenting on the collaboration between the two companies, E.K. Surendran, managing director, SRV Telecom Pvt. Ltd. said, “We believe these phones will provide the next experience in sound quality and usability to fixed line telephone connections.” SRV has put in place a design team and plans to meet expected demand for the phones by investing in a brand new manufacturing facility in Bangalore. This facility is due to open before the end of April 2007 and will have an annual production capacity of around 2,000,000 phones when it is fully operational. Once in full production, SRV plans to investigate opportunities to export the phones to markets around the world. On NXP’s role, Rajeev Mehtani, VP and Managing Director, NXP Semiconductors, India responded, “By participating in such initiatives, we intend to further contribute to the local design and manufacturing ecosystem in the booming telecommunications industry. We are pleased to enable operators to provide the more than 40 million fixed line subscribers in India with a better handset experience.” NXP Semiconductors is one of the leading providers of DECT / WDCT solutions globally. In India, many of the 700 employees at NXP’s Innovation Campus in Bangalore are directly involved in telecommunications related R&D, software and system development and customer support.