USIBC, Telangana Ink MoU, Host AI Roundtable
The US India Business Council (USIBC) Global Private Limited, part of the US Chamber of Commerce, has signed a Memorandum of Understanding (MoU) with the Department of Information Technology, Electronics & Communications (IT E&C), Government of Telangana, to enhance collaboration in technological innovation.
The MoU was formalized in the presence of Honourable Minister for IT, Electronics & Communications, and Industries & Commerce, Shri D. Sridhar Babu, and Special Chief Secretary to the Government of Telangana, Shri Jayesh Ranjan. The ceremony was attended by Ms. Jennifer Larson, US Consul General Hyderabad, and Mr. Rahul Sharma, Managing Director of USIBC, alongside industry leaders and dignitaries.
The partnership focuses on advancing key sectors such as IT, Artificial Intelligence (AI), electronics, and Global Capability Centers (GCCs). Speaking on the occasion, Shri D. Sridhar Babu highlighted Telangana’s role as a global innovation leader, stating, “This MoU marks a new chapter in our partnership with the United States, fostering investment, innovation, and employment opportunities powered by AI and GCCs”.
The event also included a roundtable discussion on AI and GCCs, emphasizing Hyderabad’s position as a global technology hub. Ms. Jennifer Larson noted, “This MoU underscores the robust collaboration between Telangana and US businesses, showcasing how regional partnerships drive innovation and economic growth”.
Shri Jayesh Ranjan lauded Hyderabad’s thriving tech ecosystem, supported by skilled professionals and progressive policies, which attracts global investments in emerging technologies.
Rahul Sharma, Managing Director of USIBC, called the agreement a significant step in bolstering US-India ties. He remarked, “By leveraging Telangana’s dynamic ecosystem and US industry expertise, we are unlocking opportunities in AI and GCCs, shaping the future of global innovation”.
The collaboration is part of the US-India Initiative on Critical and Emerging Technologies (iCET), launched by USIBC in January 2023. It aims to foster advancements in AI, semiconductors, electronics, advanced telecommunications, and space technology, strengthening economic and technological ties between the two nations.
