Kaynes Semicon Ships India's First IPM Chip Module

• Kaynes Semicon ships 900 IPM Multi-Chip Modules, a first for India.
• Developed under India Semiconductor Mission, in partnership with AOS and Mitsui.
• Sanand facility targets mass production of 1.5 million chips/day by FY2026-27.

Kaynes Semicon Private Limited, a subsidiary of Kaynes Technology India Ltd, has taken a major step in India’s semiconductor journey. The company shipped 900 Intelligent Power Module (IPM5) units, the country’s first commercially manufactured Multi-Chip Modules (MCMs), from its advanced OSAT facility in Sanand, Gujarat.

The shipment was delivered to Alpha & Omega Semiconductor (AOS), a leading U.S. based power semiconductor company, and was developed in collaboration with AOS and Mitsui under the India Semiconductor Mission 1.0.

These advanced IPM modules are used in efficient motor control and power applications, combining 17 individual chips into a compact, high-performance unit. Each module contains six IGBTs (Insulated Gate Bipolar Transistors), two controller ICs, six fast recovery diodes (FRDs), and three diodes, offering powerful performance in a small footprint.

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This milestone kicks off commercial production at Kaynes’ new facility, which is designed to handle a massive 6.3 million chips per day at full capacity. The company expects mass production to ramp up by January 2026, and daily output to hit 1.5 million chips by early FY2026-27.

This achievement positions India as a serious player in the global semiconductor space and reflects growing capabilities in advanced chip packaging and power electronics.