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Made in Silicon Valley
Ashok Chalaka
Founder, President & CEO-OnChip Devices
Tuesday, December 3, 2013
OnChip Devices, headquartered in Santa Clara, CA deals in Integrated Passive Devices. It has its own silicon fabrication facility and partnerships with full turn-keys assembly and test houses in Asia. OnChip offers silicon and ceramic solutions for High-brightness LED, Computing, and Consumer Electronics.

Silicon manufacturing appears to have diminished in its luster and seems to be on the verge of extinction in Silicon Valley. The buzz today in the high tech capital of the world seems to be driven primarily by software companies; the likes of Facebook, Google, Oracle, and Yahoo. The traditional silicon chips seem to have stepped aside to give way for Mobile Apps and iCloud. The Valley which was traditionally recognized largely for its dominance in Semiconductors still boasts the highest concentration of companies involved in the design and development of silicon Integrated
Circuits (ICs). However, much of the silicon wafer fabrication facilities have moved offshore, primarily to the Asia Pacific region. This has led to a score of serious risks such as loss of IP (intellectual property), lack of control over the production process and the
danger of finding these components in the gray market.

There is literally just a hand full of companies that have found a way to continue both innovating as well as "manufacturing" silicon products in the heart of Silicon Valley. OnChip
Devices, Inc. is one such company that has successfully found a way to produce a wide range of silicon components in Santa Clara, CA.
OnChip's products are by far the smallest Integrated Passive Devices (IPDs) produced in the world. With devices as small as 0.006" x 0.006" x 0.004" (150um x 150um x 100um or 6mils x 6mils x 4mils or 0.15mm x 0.15mm x 0.1mm), these paper-thin silicon chips have a wide range of applications such as High Brightness Light Emitting Diodes (HB LED), Mobile Handsets, Portable Consumer Electronic Products, Radio Frequency Identification (RFID) Tags so and so

HB LEDs are largely built with Indium Gallium Nitride (InGaN) technology. LEDs using InGaN come with several design challenges such as
ESD sensitivity and package thermal coefficient of expansion (TCE)issues. InGaN chips are generally considered Class one devices and in many cases, a discharge of only 10 Volts can destroy such sensitive components. In comparison, static charge of up to 30,000 Volts is not uncommon and can be generated quite easily. Studies indicate that ESD damage to electronics and associated equipment is estimated at over $10 billion annually. ESD-damaged LEDs can appear dim, dead, or shorted.
TCE mismatch between the LED chip and the lead-frame or package is another significant reliability threat. OnChip produces silicon submount that serves as an inter-poser between
the InGaN chip and the lead-frame. Submounts reduce the TCE mismatch, while providing ESD protection via integrated zener diodes. New
generation mobile computing and consumer products are increasingly susceptible to ESD events since they predominantly use Integrated Circuits with sub-micron geometries and low
working voltages. Many of OnChip’s products are used inside highly sophisticated ICs to provide protection from damage caused by Electro-static
Discharge (ESD).

OnChip is an active agent of Passive Devices and continues to set the standards for silicon based
Resistors, Capacitors and Diodes. Its products are used by several Fortune-100 companies such as GE, HP as well as IBM and was recently
recognized for its product innovation and was awarded "Small Business of the Year" for 2013 by California District 25 Assembly Member Bob
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