siliconindia | | June 20208S imulation is at the heart of modern day product designs. What every product needs is a clear sim-ulation path right from the ideation stage to design and up to testing. This enables engineers to explore more designs in less time, and ultimately, every company can get their products to market sooner at less cost thanks to sim-ulation. When it comes to the engineering workflow, any hold-up, however small, slows down the entire process and can be catastrophic. The tiny yet powerful semiconductor chips support the success of all futuristic technologies, be it driverless cars, self-guided rockets, 5G-enabled devices or even cryptocur-rency. In order for a simulator to be successful as an efficient engineering solution for semiconductors, it needs certain characteristics. This includes Accuracy/Signoff, Results in Time of Relevance, Capacity/Hierarchy/Abstractions, Us-ability & Flow Integration, Generality and Robustness to Corner Cases, among others. PERFORMANCE ENHANCEMENT Let us take the new age of semiconductors that is set to em-power transformational products. The key metrics when it comes to semiconductors are the PPA (power, performance, area) and reliability. They are driven by Artificial intelli-gence (AI), 5G, autonomous systems, augmented/virtual reality (AR/VR) and high-performance computing. In fact, engineers use standards to design semiconductors that meet the industry requirements.CONCERNS THAT ARISEThe chip that is at the centre of every electronics system, and must meet multiple conflicting requirements. There are many challenges that can crop-up while designing semicon-ductors for high-performance applications due to the inter-actions of multiple physics. To achieve good performance, engineers need to leverage low-power fin field effect tran-sistor (FinFET) and 2.5/3D integrated circuit (2.5D/3D-IC) packaging technologies. Some of the challenges can be due to the impact of power on thermal profiles, and some may be due to thermal profiles on reliability. It can also arise due By Jai Polliyal, Senior Director ­ Asia, ANSYSIN MYOPINIONLINKING ENGINEERING & EFFECTIVE SIMULATION TO ENHANCE PERFORMANCE: SEMICONDUCTORS Jai has been associated with ANSYS for over a decade now, prior to which he worked with Alliance Semiconductor, Texas Instruments, and Apache Design Solutions.Jai Polliyal
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