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Transcend releases 4GB aXeRam DDR3-2400 Memory Kits
By siliconindia
|
Tuesday, 31 August 2010, 22:40 IST
New Delhi: Transcend Information has announced the launch of 4GB aXeRam DDR3-2400 dual channel memory kits which are specifically designed for use with Intel's LGA 1156 Core i7 systems. The kits come with a lifetime warranty costing 
14,000.
The kits can perform at a frequency of 2400MHz at 1.65V, outperforming standard reference modules by approximately 60 percent. Each 4GB DDR3 kit contains two identically matched modules rated at 2400MHz with timings of 9-11-9-28 and an operating voltage of a mere 1.65V, offering theoretical memory bandwidth up to an incredible 38.4GB/s.
Gordon Wu, Regional Head-South Asia, Transcend said, "In practice, the 2400MHz clock speed shows a 60 percent performance increase in real world applications compared to standard 1333MHz memory, allowing overclocking enthusiasts and hardcore gamers to take their Intel Core i7 platform to the next level."
The high overclocking performance while maintaining cool temperatures is rendered by the kit's thermal efficiency aluminum heat sinks with cooling fins.
To ensure extra stability and signal integrity at high clock speeds, all aXeRam modules are comprised of 128Mx8 high-quality DDR3 FBGA chips and use robust PCBs that fully comply with rigorous JEDEC (Joint Electron Device Engineering Council) standards.
14,000.
The kits can perform at a frequency of 2400MHz at 1.65V, outperforming standard reference modules by approximately 60 percent. Each 4GB DDR3 kit contains two identically matched modules rated at 2400MHz with timings of 9-11-9-28 and an operating voltage of a mere 1.65V, offering theoretical memory bandwidth up to an incredible 38.4GB/s.
Gordon Wu, Regional Head-South Asia, Transcend said, "In practice, the 2400MHz clock speed shows a 60 percent performance increase in real world applications compared to standard 1333MHz memory, allowing overclocking enthusiasts and hardcore gamers to take their Intel Core i7 platform to the next level."
The high overclocking performance while maintaining cool temperatures is rendered by the kit's thermal efficiency aluminum heat sinks with cooling fins.
To ensure extra stability and signal integrity at high clock speeds, all aXeRam modules are comprised of 128Mx8 high-quality DDR3 FBGA chips and use robust PCBs that fully comply with rigorous JEDEC (Joint Electron Device Engineering Council) standards.