Bangalore: Broadcom Corporation, a global innovatior in semiconductor solutions for wired and wireless communications, introduced a highly integrated digital baseband processor and RF transceiver designed for 3G femtocell residential access points. With the new system-on-a-chip (SoC), mobile operator OEMs and ODMs have a powerful, low-cost, power efficient device to support small cell strategies and meet growing mobile traffic demands.

"As on-the-go content consumption continues to drive traffic growth, mobile operators must meet consumer’s increasing demand for higher bandwidth without sacrificing quality of service,” said Greg Fischer, Broadcom’s Vice President and General Manager for Broadband Carrier Access. “Broadcom's BCM61630 SoCs deliver a low-power, cost-efficient device for residential small cells to leverage existing mobile infrastructure and deliver faster data speeds through a smaller form factor."

The new devices further integrate a multiband CMOS RF transceiver with GPS and full time sniffing capability while maintaining software compatibility with all previous Broadcom WCDMA physical layer and backhauling interface architectures. Embedding a high speed CPU and Broadcom’s field-proven Layer 1 modem and peripherals, these devices provide a complete low power single chip solution for residential and small enterprise 3G small cell deployments.